BookSee.org
Booksee.org
Главная

WIRE BONDING IN MICROELECTRONICS, 3/E

Обложка книги WIRE BONDING IN MICROELECTRONICS, 3/E

WIRE BONDING IN MICROELECTRONICS, 3/E

I had the first edition of this book which was printed in about 1989. The new edition has been expanded to include many more details on newer technologies such as wire bonding on no traditional surfaces such as immersion gold, and nickel palladium gold.
Ссылка удалена правообладателем
----
The book removed at the request of the copyright holder.
Популярные книги за неделю:
Только что пользователи скачали эти книги: